Post-Exhibition Review | 1.6T Silicon Photonics Leads the Way! Taibicon's Booth at CIOE 2026 Was a Huge Hit, with its Full Product Line Attracting Attention
Published: 2026.09.16 14:48

currentChina Optoelectronics ExpoWith an exhibition area of ​​320,000 square meters, it brought together more than 5,000 exhibitors and attracted more than 180,000 professional visitors.

TBCOM (Taibicom Communications Technology Co., Ltd.) showcases its 1.6T~400G silicon photonics series of high-speed optical modules and its full range of 800G~10G optical modules.AOCActive optical cables and optical engines made a grand appearance, becoming one of the most eye-catching exhibitors in the Information and Communication Pavilion with their complete product matrix and cutting-edge silicon photonics technology.


01 On-site report: Crowds thronging, lively exchanges


The exhibition lasted three days.Our sideThe booth remained consistently popular. On the first day of the exhibition, a large number of professional visitors from data center operators, cloud service providers, equipment manufacturers, system integrators, and research institutions gathered in front of the booth. The 1.6T silicon photonics series product display area became the focus of the entire event.They engaged in in-depth discussions regarding product parameters, application scenarios, and delivery capabilities.

From product technical details to mass production capabilities, from data center interconnects to long-distance transmission of computing power networks,usThe sales team was on-site throughout the event, providing professional and detailed answers to every visiting customer. The booth's negotiation area was packed, with multiple in-depth business negotiations taking place simultaneously on-site.


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02 Core Products: The full range of silicon photonics products, defining a new standard for high-speed interconnects.


At this year's CIOE, the biggest highlight of Teradyne's exhibit was its new generation of high-speed silicon photonics modules. From 400G to 1.6T, from DR4 short-range to FR4 medium-range, Teradyne's complete product lineup comprehensively covers the core interconnection needs of next-generation data centers and computing networks.

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1.6T OSFP 2xDR4 / 2xFR4: Ultra-wideband, low power consumption

As the flagship products showcased at this exhibition, the 1.6T OSFP 2xDR4 and 2xFR4 silicon photonics modules adopt an innovative dual-path architecture design, achieving an ultra-high bandwidth of 1.6Tbps per module. The 2xDR4 has a transmission distance of up to 500 meters, while the 2xFR4 has a transmission distance of up to 2 kilometers.

Both products are built on a silicon photonics integrated platform, integrating a light engine,DSPHighly integrated with the package, it significantly reduces power consumption while achieving ultra-wide bandwidth, helping data centers effectively control PUE and operating costs in the era of explosive growth in computing power.


800G OSFP 2xDR4 / 2xFR4: Mainstream speed, mass production800G is currently the mainstream speed for data center upgrades. 800G OSFP 2xDR4 and 2xFR4SiP ModuleAlso employing a dual-path architecture, it retains the advantages of OSFP packaging while featuring high integration, low power consumption, and high bandwidth. The product is already capable of low-cost mass production and can quickly respond to customers' large-scale deployment needs.

400G OSFP DR4 / 400G QSFP112 DR4: Mature solutions, flexible adaptation

For customers who are still deploying 400G on a large scale,usTwo silicon photonics products were also showcased: the 400G OSFP DR4 and the 400G QSFP112 DR4. The former continues the heat dissipation and evolution advantages of OSFP packaging, while the latter adopts the industry-leading QSFP112 packaging, with 112G PAM4 modulation on a single channel and a total of 400G across 4 channels. It is compatible with existing switch platforms, helping customers to complete smooth network upgrades at a lower cost.

03 Full Matrix Deployment: From 10G to 800G, covering all scenarios of short, medium and long distances.


In addition to the silicon photonics series, the company also showcased a full range of optical modules covering 10G to 800G, AOC active optical cables, and 400G/800G optical engines, demonstrating its complete industry chain capabilities from core components to terminal modules.

Short, medium, and long-distance optical interconnects: a full range of 10G~800G optical modules


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From 10G SFP+ to 800G OSFP, the full range of optical modules covers diverse application scenarios such as data centers, computing infrastructure, mobile communication networks, and government and enterprise private networks.


Multimode short-range (rack interconnect)

400G OSFP SR4, 400G QSFP-DD SR4, 400G QSFP-DD SR8, and 400G QSFP112 SR4 meet the needs of low-cost, high-density short-distance cabling with mature multimode solutions;


Single-mode short-distance (inter-rack interconnection)

The 400G QSFP-DD DR4 achieves a good balance between transmission distance and power consumption.


Single-mode mid-range (industrial park)/Building Internet

400G QSFP-DD FR4, meeting the requirements for cross-building transmission over a distance of 2 kilometers;


Single-mode long-distance (metropolitan area network)

400G QSFP-DD LR4, supporting long-distance transmission up to 10 kilometers.

                       Short-range high-speed interconnect: 10G~800G AOC full series

 
In short-distance, high-speed interconnect scenarios within data centers, AOC active optical cables have become the mainstream choice due to their lower power consumption, lower cost, and superior signal integrity. Teradyne's full range of 10G~800G AOC products features an integrated packaging design, offering plug-and-play functionality. They are widely applicable for high-speed interconnects within racks, between racks, and between adjacent racks, helping customers effectively reduce data center cabling complexity and overall cost.TCO

Core components: 400G/800G optical engine


The independently developed light engine not only ensures the core performance of its own module products.We provide core components and offer flexible component-level collaboration options for industry customers.


04 Moving Forward with Honors: Empowering the Computing Era with Silicon Photonics Innovation


Over the three-day exhibition, the Taibicom booth received over a thousand professional visitors and facilitated hundreds of in-depth technical exchanges and business negotiations. This not only recognizes the strength of Taibicom's products but also confirms the broad prospects of high-speed optical interconnect technology solutions.

With the accelerated construction of large-scale AI models and computing infrastructure, the demand for 1.6T and higher-speed optical interconnects is rapidly increasing. Teradycom will continue to increase its investment in technological research and development, improve its full-chain product portfolio from optical engines to optical modules, and work with global customers to build a new era of high-speed, efficient, and green computing interconnects with more competitive products and services.

Thank you to everyone who stopped by the Taibicon booth at CIOE 2026. See you next time, with even more complete answers.




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