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production and manufacturing
R&D Innovation production and manufacturing
Suzhou · Production Base

The production base in Suzhou has a 12,000+ square meter dust-free workshop of ten-thousand grade, providing a one-stop production process from devices, COB, assembly to testing.

It has four packaging platforms: coaxial packaging, multimode COB, micro-optics, and COB + hybrid integration platform.From chips, devices, modules to applications: Relying on independent innovation and focusing on high-speed data transmission optoelectronic products.

12000+㎡
Class 10,000 cleanroom
200+ persons
Number of production personnel
3lines
Full-automatic Production Line
4types
Module Packaging Process
Three Fully Automated Production Lines
Delivering precision manufacturing from core components to finished optical modules
COB Packaging + High-End Device Planar Packaging
High-End Device Packaging Auto Production Line
25G/50G/100G/200G/400G/800G/1.6T
High-End Module Production Line
10G/25G/40G/100G/200G/400G/800G
AOC Active Optical Cable Production Line
Silicon Photonics Product Packaging
Utilize a Mature Optoelectronic Module Packaging Platform
automated silicon photonics FA coupling equipment
automated vitrification bonding machine
silicon photonics chip packaging
Die & Wire-Bonding
and COB Packaging Processes
Design different scanning parameters; determine optimal packaging process via pull-push force, sem, crater and other tests

Pull-push force test

SEM inspection

Crater test

Wire-bonding parameter optimization

vcsel chip packaging process doe test results summary
Leg 1 2 3 4 5 6 7 8 9
Power 300 300 320 320 280 300 280 320 280
Time 10 15 20 10 15 20 10 15 20
Force 10 15 10 15 10 20 10 15 20
Ball Shear 26.744 26.488 28.028 36.644 28.488 36.524 27.566 35.532 29.842
Wire Pull 13.724 14.858 14.964 14.396 14.024 13.53 11.43 13.292 11.204
Stitch Pull 13.874 14.638 14.222 14.342 14.04 14.23 13.722 14.388 13.52
Ball Size 63 64 63 65 62 63 63 64 62
Ball Size 0 0 0 0 0 0 0 0 0
Lens Design and Coupling Process Verification
Lens and optical path design
Cob Testing and Analysis
Lens and optical path design
design and optimize the lens based on the size and mode field size of the vcsel chip, as well as design the chip mounting position
Optical Simulation and Chip Mounting Position Design
Coupling Profile Scanning
Automated Coupling Machine & EF Testing
Cob Testing and Analysis
conduct analysis of three-temperatureTx Power, Rx responsivity and EF (encircled flux), and determine subsequent coupling standards
Three-Temperature Tx Power Analysis
Rx Responsivity Analysis
EF (Encircled Flux) Analysis
OSFP Process Flow

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Contact Us
Headquarters Address

Building 6,No.199,Guanpu Road,Guoxiang,Wuzhong Economic Development Area,Suzhou

Tel：＋86-512-66257838


Sales E-Mail: sales@terabitcom.com

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